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Bondline 700 is an electrically isolating thermal adhesive tape designed to mechanically fix and thermally connect electronic devices and FR4 PCBs to a heatsink. Formulated from acrylic, Bondline 700 is pressure sensitive and the differing thicknesses conform to varying surface textures which fills micro-air voids between contact surfaces and reduces thermal resistance. Bondline 700 is developed for applications requiring good thermal transfer, dielectric strength and permanent adhesion.
Property (unit) | Test Method | Bondline 700 (0.25mm) |
---|---|---|
Colour | Visual | White |
Thermal Conductivity (W/mK) | ASTM D5470 | 1.1 |
Thermal Resistance (Kcm²/W) | ASTM D5470 | 3 |
Operating Temp (°C) | In House | -25 to +130 |
Property (unit) | Test Method | Bondline 700 (0.25mm) |
---|---|---|
Shear Adhesion (kg/cm²) | ASTM D-1002 | 3.5 |
Tensile Strength (Kg/cm) | ASTM 412 | 0.15 |
Breakdown Voltage (Volts AC) | ASTM D149 | >6000 |
Elongation (%) | ASTM 412 | 400 |
Flame Rating | UL94 | V2 |
Available in standard thicknesses of 0.15mm, 0.25mm and 0.5mm |
Supplied on 30m to 50m rolls and to specified widths on request |
Available as custom kiss-cut parts on rolls for starboards and as die-cut custom shapes |
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