Description
Bondline 310 is a thermally conductive double-sided adhesive tape formed from a thin polymer coated with thermal adhesive on both sides. Bondline 310 is designed to attach two surfaces that require a strong, permanent bond, excellent thermal connection and guaranteed electrical insulation up to 65000 volts. Bondline 310 offers a high performance thermal solution for bonding heat generating electronics to a heatsink, cold wall or chassis.
Benefits
- Removal of micro air voids between mating surfaces reduces thermal resistance
- Extremely thin bond line of 0.12mm for improved thermal performance
- High dielectric strength for demanding electronic applications





