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BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforced, Silicone-based Insulator
The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips.
Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimises interfacial thermal resistance and maximises thermal performance.
|Shore Hardness, ASTM D2240, Shore A||92|
|Elongation , 45º to warp and fill, ASTM D412,%||20|
|Tensile Strength, ASTM D412, MPa||9|
|Flammability Rating, UL 94||V-0|
|Dielectric Breakdown Voltage , ASTM D149, Vac||5,500|
|Dielectric Constant, ASTM D150 @ 1,000 Hz||6.0|
|Volume Resistivity, ASTM D257, ohm-meter||1×10¹°|
|TO-220 Thermal Performance, ºC/W|
|@ 10 psi||3.96|
|@ 25 psi||3.41|
|@ 50 psi||2.9|
|@ 100 psi||2.53|
|@ 200 psi||2.32|
|Thermal Impedance, ASTM D5470, ºC-in2 /W|
|@ 10 psi||0.95|
|@ 25 psi||0.75|
|@ 50 psi||0.61|
|@ 100 psi||0.47|
|@ 200 psi||0.41|
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