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13 Sheets In Stock
BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforced, Silicone-based Insulator
The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips.
Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimises interfacial thermal resistance and maximises thermal performance.
Shore Hardness, ASTM D2240, Shore A | 92 |
Elongation , 45º to warp and fill, ASTM D412,% | 20 |
Tensile Strength, ASTM D412, MPa | 9 |
Flammability Rating, UL 94 | V-0 |
Dielectric Breakdown Voltage , ASTM D149, Vac | 5,500 |
Dielectric Constant, ASTM D150 @ 1,000 Hz | 6.0 |
Volume Resistivity, ASTM D257, ohm-meter | 1×10¹° |
TO-220 Thermal Performance, ºC/W | |
---|---|
@ 10 psi | 3.96 |
@ 25 psi | 3.41 |
@ 50 psi | 2.9 |
@ 100 psi | 2.53 |
@ 200 psi | 2.32 |
Thermal Impedance, ASTM D5470, ºC-in2 /W | |
---|---|
@ 10 psi | 0.95 |
@ 25 psi | 0.75 |
@ 50 psi | 0.61 |
@ 100 psi | 0.47 |
@ 200 psi | 0.41 |
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