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Bergquist Sil Pad TSP 1800ST – 0.38mm
August 5, 2019
Bergquist Sil Pad TSP 900 – A1 – 0.18mm
August 3, 2021
Description
BERGQUIST SIL PAD TSP 1600S, Fiberglass-reinforced, Silicone-based Insulator
The true workhorse of the SIL PAD product family, BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material, is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimises interfacial thermal resistance and maximises thermal performance.
Benefits
- Smooth and highly compliant surface
- General-purpose thermal interface material solution
Features
- Thermal impedance: 0.61ºC-in2 /W @ 50 psi
- Electrically isolating
- Low mounting pressures
Recommended Uses
- Power supplies
- Automotive electronics
- Motor controls
- Power semiconductors
Physical Properties
| Shore Hardness, ASTM D2240, Shore A | 92 |
| Elongation , 45º to warp and fill, ASTM D412,% | 20 |
| Tensile Strength, ASTM D412, MPa | 9 |
| Flammability Rating, UL 94 | V-0 |
Electrical Properties
| Dielectric Breakdown Voltage , ASTM D149, Vac | 5,500 |
| Dielectric Constant, ASTM D150 @ 1,000 Hz | 6.0 |
| Volume Resistivity, ASTM D257, ohm-meter | 1×10¹° |
Thermal Performance vs. Pressure
| TO-220 Thermal Performance, ºC/W | |
|---|---|
| @ 10 psi | 3.96 |
| @ 25 psi | 3.41 |
| @ 50 psi | 2.9 |
| @ 100 psi | 2.53 |
| @ 200 psi | 2.32 |
| Thermal Impedance, ASTM D5470, ºC-in2 /W | |
|---|---|
| @ 10 psi | 0.95 |
| @ 25 psi | 0.75 |
| @ 50 psi | 0.61 |
| @ 100 psi | 0.47 |
| @ 200 psi | 0.41 |
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Universal Science T-Pad 1500 – A1 – 0.23mm
£0.00 SKU: UNISCI_TPAD1500_A1_0.23MM- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
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- A1 – Adhesive layer on one side
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- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
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