Description
The BERGQUIST® SIL PAD® TSP 1800ST is a high-performance thermal interface material (TIM) designed for efficient heat dissipation and electrical insulation in demanding electronic applications. This silicone-based, fiberglass-reinforced pad delivers superior thermal conductivity of 1.8 W/m·K, ensuring optimal heat transfer between power components and heat sinks. Its naturally tacky surfaces allow for easy placement and secure positioning without additional adhesives, streamlining the assembly process. The low compression force and high conformability make it ideal for applications where minimizing mechanical stress on components is crucial.
With exceptional durability and cut-through resistance, the SIL PAD® TSP 1800ST is a reliable solution for power electronics, motor controls, automotive modules, and industrial equipment requiring efficient thermal management. Available in sheet and roll form, it supports automated placement processes, making it a cost-effective choice for high-volume manufacturing. This high-quality thermal interface pad ensures long-term performance, safety, and reliability, meeting stringent industry standards, including a UL 94 V-0 flammability rating for enhanced fire safety.
Benefits
- Superior Thermal Performance
- Easy, Adhesive-Free Application
- Reliable & Durable




