Bergquist Gap Pad TGP HC5000 – 1.524mm | Henkel

Known as BERGQUIST GAP PAD HC 5.0

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  • Thermal Conductivity: 5.0 W/m-K
  • Hardness Shore 00 = 35
  • Dielectric Breakdown Voltage = 5000
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Stock sheet size: 20.32cm x 40.64cm

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Order Total Discount
£1 - £500 N/A
£501 - £1000 1% discount
£1001 - £2500 2% discount
£2501 - £5000 3% discount
£5001 - £10000 4% discount
£10001 - £25000 5% discount
£25001 - £50000 7.5% discount
£50001+ 10% discount

Description

BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.

BERGQUIST GAP PAD TGP HC5000 maintains a conformable nature that allows excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000 is supplied with protective liners on both sides.

Benefits

  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance
  • Electrically isolating

Features

  • Thermal Conductivity: 5.0 W/m-K
  • Hardness Shore 00 = 35
  • Dielectric Breakdown Voltage = 5000

Recommended Uses

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal modules to heat sinks
Specifications
Technology Silicone
Appearance Grey
Reinforcement Carrier Fiberglass
Thickness ASTM D374 *0.508, 1.016, 1.524,
2.032, 2.540, 3.175
Inherent Surface Tack 2
Application Thermal management,
TIM (Thermal Interface Material)
Operating Temperature
Range
-60 to 200ºC
Physical Properties
Properties Value
Hardness, Shore 00, Thirty second delay value, ASTM D2240, Bulk rubber 35
Heat Capacity, ASTM E1269, J/g-K 1.0
Density, Bulk rubber, ASTM D792, g/cc 3.2
Flammability, UL 94 V-0
Young’s Modulus, ASTM D575 kPa 121 (psi 17.5)
Electrical Properties
Properties Value
Dielectric Breakdown Voltage, ASTM D149,
Minimum value @ 20 mil, VAC
5,000
Dielectric Constant, ASTM D150, 1,000Hz 8.0
Volume Resistivity, ASTM D257, ohm-meter 1×10<sup>10</sup>
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 5.0
Thermal Impedance, 0.040 inch
ASTM D5470, ºC-in2
/W: 10% Deflection
0.35
Thermal Impedance, 0.040 inch
ASTM D5470, ºC-in2
/W: 20% Deflection
0.3
Thermal Impedance, 0.040 inch
ASTM D5470, ºC-in2
/W: 30% Deflection
0.26





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