Description
The BERGQUIST® GAP PAD® TGP 5000 is a high-performance, silicone-based thermal interface material (TIM) designed to provide efficient heat transfer and electrical insulation in advanced electronic assemblies. Manufactured by Henkel, this soft and highly conformable gap pad ensures optimal contact between heat-generating components and heat sinks, minimizing thermal resistance and maximizing heat dissipation.
With a thermal conductivity of 5.0 W/m·K, the TGP 5000 is ideal for applications requiring low-stress thermal management, such as power electronics, automotive modules, high-performance computing, and telecommunications hardware. Reinforced with fiberglass, it offers excellent puncture, shear, and tear resistance, ensuring durability while maintaining flexibility to fill air gaps. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance.
Benefits
- Thermal Conductivity: 5 W/m-K
- Conformable, low hardness
- Electrically isolating




