Description
BERGQUIST® GAP PAD® TGP 3500ULM is a high-performance, silicone-based thermal interface material (TIM) designed for applications requiring low-stress thermal management and superior heat dissipation. Manufactured by Henkel, this highly conformable gap pad ensures optimal contact between heat-generating components and heat sinks, filling air gaps and minimizing thermal resistance for enhanced thermal conductivity.
With a thermal conductivity of 3.5 W/m·K, the TGP 3500ULM is ideal for demanding applications in consumer electronics, power electronics, telecommunications, automotive modules, and high-performance computing systems. Its fiberglass reinforcement ensures puncture, shear, and tear resistance, making it durable and reliable for both short-term assembly and long-term operation. Additionally, the natural tack on one side of the pad eliminates the need for additional adhesives, simplifying the assembly process.
Benefits
- High Thermal Conductivity (3.5 W/m·K)
- Ultra-Soft & Conformable
- Fiberglass Reinforced





