Bergquist Gap Pad TGP 1500 – 0.5mm | Henkel

Known as BERGQUIST GAP PAD 1500 | Silicone

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  • Thermal Conductivity: 1.5 W/m-K
  • Conformable, low hardness
  • Electrically isolating
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Stock sheet size: 40.64cm x 20.32cm

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Description

BERGQUIST® GAP PAD® TGP 1500 is a premium thermal interface material (TIM) engineered for efficient heat dissipation and electrical isolation in high-performance electronics. Developed by Henkel, this silicone-based, soft-gap filler pad is designed to provide excellent thermal conductivity while conforming to irregular surfaces, ensuring minimal thermal resistance between components and heat sinks.

With a thermal conductivity of 1.5 W/m·K, the TGP 1500 is an ideal solution for managing excess heat in applications such as power electronics, telecommunications, automotive systems, and industrial computing. Its natural tack on both sides allows for easy application, reworkability, and long-term durability, making it a reliable choice for engineers looking to enhance thermal management in compact or high-power devices.

Benefits

  • Superior Thermal Conductivity
  • Enhanced Conformability
  • Versatile Applications
  • Reliable & Trusted Brand

Features

High Thermal Conductivity (1.5 W/m·K)

  • Efficiently transfers heat from components to heat sinks, reducing thermal resistance and preventing overheating.

Soft & Conformable Material

  • Easily conforms to uneven surfaces, eliminating air gaps for improved heat dissipation.

Natural Tack on Both Sides

  • Provides easy handling, application, and reworkability without requiring additional adhesives.

Excellent Electrical Isolation

  • Protects components from electrical shorts while maintaining strong thermal performance.

Durable & Long-Lasting Performance

  • Maintains stability under extreme temperatures and conditions.

Wide Operating Temperature Range (-60°C to 200°C)

  • Reliable in harsh environments, including automotive, aerospace, and industrial applications.

UL 94 V-0 Flammability Rating

  • Meets stringent safety and flammability standards for critical electronic applications.

Recommended Uses

  • Power Electronics – Ensures efficient cooling in power supplies, inverters, and battery management systems (BMS).
  • Computing & Servers – Enhances heat dissipation in CPUs, GPUs, SSDs, and high-performance computing (HPC) systems.
  • Telecommunications Equipment – Provides reliable heat management in 5G network hardware, RF modules, and data transmission devices.
  • Automotive & EV Electronics – Optimized for ECUs, ADAS systems, and electric vehicle power modules.
  • LED & Lighting Systems – Prevents overheating in high-powered LED applications, extending lifespan and performance.

Physical Properties

Property Unit Value
Hardness,<br>Thirty second delay value,
ASTM D2240, Bulk rubber
Shore 00 40
Heat Capacity, ASTM E1269 J/g-K 1.0
Density, Bulk rubber, ASTM D792 g/cc 2.1
Flammability UL 94 V-0
Young’s Modulus, ASTM D575 kPa<br>psi 310<br>45

Electrical Properties

Property Unit Value
Dielectric Breakdown Voltage, ASTM D149 VAC >6,000
Dielectric Constant, ASTM D150 1,000Hz 5.5
Volume Resistivity, ASTM D257 ohm-meter 1×10¹¹

Thermal Properties

Property Unit Value
Thermal Conductivity, ASTM D5470 W/(m-K) 1.5
Thermal Impedance, 0.040 inch<br>
ASTM D5470:<br>10% Deflection<br>20% Deflection<br>30% Deflection
<br><br>ºC-in2
/W
<br><br>1.62<br>1.5<br>1.33





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