Description
BERGQUIST® GAP PAD® TGP 1500 is a premium thermal interface material (TIM) engineered for efficient heat dissipation and electrical isolation in high-performance electronics. Developed by Henkel, this silicone-based, soft-gap filler pad is designed to provide excellent thermal conductivity while conforming to irregular surfaces, ensuring minimal thermal resistance between components and heat sinks.
With a thermal conductivity of 1.5 W/m·K, the TGP 1500 is an ideal solution for managing excess heat in applications such as power electronics, telecommunications, automotive systems, and industrial computing. Its natural tack on both sides allows for easy application, reworkability, and long-term durability, making it a reliable choice for engineers looking to enhance thermal management in compact or high-power devices.
Benefits
- Superior Thermal Conductivity
- Enhanced Conformability
- Versatile Applications
- Reliable & Trusted Brand




