Description
3M™ Thermally Conductive Silicone Interface Pad 5591 is a highly conformable and ultra-soft pad with thermal conductivity of 1.0 W/m-K (ASTM D5470). This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat-generating components to heat sinks and cooling devices, improving device reliability and extending the component’s life.
3M™ Thermally Conductive Silicone Interface Pad 5591 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
