3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance
Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Good electrical insulation properties
Good flame retardant, UL94 V-0 equivalent material
Compression relaxation properties help reduce pressure to electric components
Integrated chip (IC) packaging heat conduction, Heat sink interface, Chip on film (COF) heat conduction, LED board thermal interface material (TIM), HDTV integrated chip (IC), General gap filling in electronic device.