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3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
|Thickness||0.5 – 2.0mm*|
|Primary Filler Type||Ceramic|
|Product Liner||PET Film Liner|
|Thermal Conductivity (W/m-K)||ASTM D5470||5 W/m-K|
|Density (g/cm3 , @ 25°C)||ASTM D6111||3.1|
|Operating Temperature Range||3M test method||-50°C to 140°C|
|Hardness Shore 00b||Modified ASTM D2240||70 ~ 80|
|UL Flame Class c||UL94||V-0|
|Dielectric Breakdown||Modified ASTM D149 (3M test method)||2 kV/mm|
|Volume Resistivity||ASTM D257||1.7 x 1014 Ohms|
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