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3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
Colour | Grey |
Base resin | Silicone |
Thickness | 0.5 – 2.0mm* |
Primary Filler Type | Ceramic |
Product Liner | PET Film Liner |
Property | Method | Value |
---|---|---|
Thermal Conductivity (W/m-K) | ASTM D5470 | 5 W/m-K |
Density (g/cm3 , @ 25°C) | ASTM D6111 | 3.1 |
Operating Temperature Range | 3M test method | -50°C to 140°C |
Hardness Shore 00b | Modified ASTM D2240 | 70 ~ 80 |
UL Flame Class c | UL94 | V-0 |
Dielectric Breakdown | Modified ASTM D149 (3M test method) | 2 kV/mm |
Volume Resistivity | ASTM D257 | 1.7 x 1014 Ohms |
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