3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
Good flame retardant, UL94 V-0 equivalent material
Compression relaxation properties help reduce pressure to electric components
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance