5519 Thermal Interface Pad – 1mm | 3M™Custom pads and gaskets priced instantly and made to order within 24 hours!

5519 Thermal Interface Pad – 1mm | 3M™

Thermally Conductive Silicone Interface Pad

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  • Very high thermal conductivity and good electrical insulation properties
  • Good softness and conformability even to non-flat surfaces
  • Good electrical insulation properties
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Description

3M™ Thermally Conductive Silicone Interface Pad 5519 is a high-performance thermal interface material engineered to efficiently manage heat in electronic devices. This pad is made from a soft, conformable silicone elastomer that is filled with thermally conductive ceramic particles, providing exceptional thermal conductivity of 4.9 W/m-K. It is designed to bridge the thermal gap between heat-generating components like processors, power supplies, and heat sinks or other cooling devices, ensuring efficient heat dissipation and preventing overheating.

Benefits

  • High Thermal Conductivity
  • Conformability
  • Electrical Insulation

Features

High Thermal Conductivity

  • Ensures efficient heat transfer from heat-generating components to cooling devices.

Conformable and Soft

  • Adapts to uneven surfaces, improving thermal contact and reducing thermal resistance.

Electrical Insulation

  • Offers excellent dielectric strength, protecting sensitive electronic components.

Flame Retardant

  • Meets UL 94 V-0 standards, providing enhanced fire safety.

Slight Tackiness

  • Allows for easy pre-assembly and improved wettability for better thermal conductivity.

Recommended Uses

  • Integrated Circuit (IC) Packaging: Facilitates heat conduction between ICs and heat sinks.
  • Heat Sink Interfaces: Improves thermal management between heat sinks and electronic components.
  • Chip-on-Film (COF) Heat Conduction: Enhances heat transfer in COF applications.
  • LED Board Thermal Interface: Manages heat dissipation in LED modules.
  • High-Definition Television (HDTV) ICs: Assists in thermal regulation of ICs in HDTVs.
  • General Gap Filling in Electronic Devices: Provides thermal management in various electronic applications.

Physical Properties

Property Value
Color Gray
Base resin Silicone
Thickness 0.5 – 2.0mm*
Primary Filler Type Ceramic
Product Liner PET Film Liner

Mechanical Properties

Property Method Value
Thermal Conductivity (W/m-K) ASTM D5470 5 W/m-K
Density (g/cm³
, @ 25°C)		 ASTM D6111 3.1
Operating Temperature Range 3M test method -50°C to 140°C
Hardness Shore 00ᵇ Modified ASTM D2240 70 ~ 80
UL Flame Classᶜ UL94 V-0
Dielectric Breakdown Modified ASTM D149 (3M test method) 2 kV/mm
Volume Resistivity ASTM D257 1.7 x 10¹⁴ Ohms

3m 5519 Datasheet





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