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3M™ 5519 Thermal Pad – 2mm
August 5, 20193M™ 5519 Thermal Pad – 1mm
August 5, 2019
3M™ 5519 Thermal Pad – 1.5mm
Thermally Conductive Silicone Interface Pad
£0.00
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- Very high thermal conductivity and good electrical insulation properties
- Good softness and conformability even to non-flat surfaces
- Good electrical insulation properties
Product is on backorder, Please allow 35 working days for delivery of this item
Description
3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5519 is designed to provide a preferential heat-transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5519 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provide enhanced thermal conductivity and excellent electrical insulation performance.
Benefits
- Good flame retardant, UL94 V-0 equivalent material
- Compression relaxation properties help reduce pressure to electric components
- Slight tack allows pre-assembly
- Good wettability for improved and lower thermal resistance
Features
- Gray
- Silicone
- 0.5 – 2.0mm*
- Ceramic
- PET Film Liner
Recommended Uses
- Integrated chip (IC) packaging heat conduction
- Heat sink interface
- Chip on film (COF) heat conduction
- LED board thermal interface material (TIM)
- HDTV integrated chip (IC)
- General gap filling in electronic device
Physical Properties
| Property | Method | Value |
|---|---|---|
| Thermal Conductivity (W/m-K) | ASTM D5470 | 5 W/m-K |
| Density (g/cm3 , @ 25°C) | ASTM D6111 | 3.1 |
| Operating Temperature Range | 3M test method | -50°C to 140°C |
| Hardness Shore 00b | Modified ASTM D2240 | 70 ~ 80 |
| UL Flame Classc | UL94 | V-0 |
| Dielectric Breakdown | Modified ASTM D149 (3M test method) | 2 kV/mm |
| Volume Resistivity | ASTM D257 | 1.7 x 1014 Ohms |
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