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- All purpose – can be laminated, diecut, slit, formed, or adhesive-coated.
- It does not melt. It can be used at both high and low temperature extremes.
- Kapton® polyimide films can be used in a variety of electrical and electronic uses.
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- All purpose – can be laminated, diecut, slit, formed, or adhesive-coated.
- It does not melt. It can be used at both high and low temperature extremes.
- Kapton® polyimide films can be used in a variety of electrical and electronic uses.
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- Highest thermal conductivity for a polyimide film
- High mechanical integrity
- Extended storage between 4-29°C (40-85°F)
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- Highest thermal conductivity for a polyimide film
- High mechanical integrity
- Extended storage between 4-29°C (40-85°F)
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- 3x the thermal conductivity and cut through strength of standard Kapton® HN.
- Excellent breakdown voltage, mechanical resilience, and flexibility
- MT has higher modulus than HN; this offers improved strength to the final product.
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- 3x the thermal conductivity and cut through strength of standard Kapton® HN.
- Excellent breakdown voltage, mechanical resilience, and flexibility
- MT has higher modulus than HN; this offers improved strength to the final product.
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- Exceptional thermal stability
- Outstanding mechanical toughness
- Inherent dielectric strength
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Exceptional thermal stability
Outstanding mechanical toughness
Inherent dielectric strength -
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- Excellent for high-temperature applications
- Will not delaminate or blister at high temperatures
- High dielectric strength
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- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
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- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
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- Good thermal conductivity and good electrical insulation properties.
- Good softness and conformability even to non-flat surfaces.
- Softness results in low stress on board components
