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- Closed cell foam gasket
- Halogen and CFC free
- Sealing and Anti-slip properties
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- Extreme high light transmission and high diffusivity at the same time
- Extreme impact strength
- Resistance to wide range of temperature
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- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
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- Good thermal conductivity and good electrical insulation properties.
- Good softness and conformability even to non-flat surfaces.
- Softness results in low stress on board components
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- Very high thermal conductivity and good electrical insulation properties
- Good softness and conformability even to non-flat surfaces
- Good electrical insulation properties
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- Good thermal stability of the base polymer with the excellent softness of the thermal pad.
- Good thermal conductivity in an ultra-soft silicone polymer base.
- The product tack is such that a mechanical means to support the pad in a final assembly is required.
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- Good thermal stability of the base polymer with excellent softness of the thermal pad.
- Good thermal conductivity in a soft silicone polymer base.
- The product tack is such that a mechanical means to support the pad in a final assembly is required.
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- Good thermal conductivity (>1.5W/m-K)
- Excellent dielectric performance
- Low thermal impedance
- Good and reliable adhesion performance to Al and SS
- Vibration damping
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
