Showing 1–12 of 67 results
-
Select options
- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
-
Select options
- Good thermal stability of the base polymer with excellent softness of the thermal pad.
- Good thermal conductivity in a soft silicone polymer base.
- The product tack is such that a mechanical means to support the pad in a final assembly is required.
-
Select options
- Good thermal stability of the base polymer with excellent softness of the thermal pad.
- Good thermal conductivity in a soft silicone polymer base.
- The product tack is such that a mechanical means to support the pad in a final assembly is required.
-
Select options
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
-
Select options
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
-
Select options
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
-
Select options
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
-
Select options
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
-
Select options
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
-
Select options
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
-
Select options
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity -
Select options
- Soft and compressible for low stress applications
- Naturally tacky needing no further adhesive coating
- 1.1 W/mK thermal conductivity
