Thermal Gap Pads are used to couple hot electronics devices to heat sinks or heat spreaders. They offer heat transfer properties, vibration damping and are naturally tacky but without adhesive. The material appears sticky but is cleverly removing air voids present as the surfaces of hot devices and the heat sink. The stickiness of the material is the effect of the materials ability to remove air voids in your fingerprint which makes it feel tacky.
Brands
Showing 1–12 of 102 results
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- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
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- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
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- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
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- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
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- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
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- Compliant and electrically insulating
- Thermal conductivity = 1.8 W/mK
- Delivers excellent vibration dampening properties
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Soft and compressible for low stress applications
- Naturally tacky needing no further adhesive coating
- 1.1 W/mK thermal conductivity
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Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials.
Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities.
The basic Gap Filler Pad series can be further enhanced for special handling and die-cutting requirements. -
Select options
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
