Showing 1–12 of 16 results
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- Dry compound coated onto an aluminium substrate
- Above phase change temperature compound becomes thixotropic and paste-like in consistency
- Delivers a highly reliable and consistent thermal interface for demanding applications
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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- Superior replacement for messy thermal greases.
- Operating temperature range: up to 150ºC.
- Highly efficient thermal transfer material.
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- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
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- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
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- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
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- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
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The Tpcm 580 Series is a high-performance thermal phase change material (PCM) designed
to meet the thermal reliability and price requirements of high-end thermal applications.
The Series is inherently tacky, flexible and exceptionally easy-to-use. .
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- 0.03ºC-in2/watt thermal resistance
- Naturally tacky at room temperature, no adhesive required
- No heatsink preheating required
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- 0.03ºC-in2/watt thermal resistance
- Naturally tacky at room temperature, no adhesive required
- No heatsink preheating required
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- 0.03ºC-in2/watt thermal resistance
- Naturally tacky at room temperature, no adhesive required
- No heatsink preheating required
Select options