Non-silicon Gap Pad
Non-silicon Gap Pads
Non-Silicone Gap Pad is supplied in applications where no silicon element should be present. Siliconsensite applications are often in telecommunication or automotive applications. This was normally from the risk of silicon oxide forming but our modern materials do not have a high percentage of free silicon content to mitigate this risk.
Showing 1–15 of 69 results
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Laird Tflex™ SF870 – 1.75mm
SKU: 94103Select Options- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 8.0 W/ mK
- Excellent compressibility
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Laird Tflex™ SF880 – 2mm
SKU: 94104Select Options- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 8.0 W/ mK
- Excellent compressibility
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Laird Tflex™ SF890 – 2.25mm
SKU: 94105Select Options- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 8.0 W/ mK
- Excellent compressibility
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Tflex SF820™ – 0.5mm | Laird
SKU: 94098Select Options- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 8.0 W/ mK
- Excellent compressibility
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Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
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Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
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Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
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Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection
-
Select Options
- Silicone free formulation
- Thermal conductivity = 10.0 W/ mK
- Low pressure versus deflection


