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Thermal Interface Materials

Thermal interface materials or TIM’s are used to interface between hot components or assemblies nearby heat sinks or heat spreaders. They are often electrically isolating to perform protection for the users or internally to protect other parts of the assembly from unwanted high voltages

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Brands

Showing 1–12 of 128 results

  • Uniscience Uniphase 4000 COB web

    Universal Science UniPhase 4000 COB – 0.25mm

    £0.00 SKU: UNISCI_UNIPHASE4000COB_0.25MM
    • Silicon Free with Low thermal resistance
    • Highly reliable and consistent thermal interface for demanding applications such as LED COB
    • Non-reinforced film
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  • Uniscience Uniphase 4000 COB web

    Universal Science UniPhase 4000 COB – 0.125mm

    £0.00 SKU: UNISCI_UNIPHASE4000COB_0.125MM
    • Silicon Free with Low thermal resistance
    • Highly reliable and consistent thermal interface for demanding applications such as LED COB
    • Non-reinforced film
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  • Laird Tgard300 web
    • High breakdown voltage of 6,000 volts AC
    • Thermal resistance of 0.50º C-in2/watt at 50 psi
    • Unique coating formulation offers low mounting forces
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  • T-Pad 1500
    • Electrically insulating and moderate thermal performance properties
    • Thermal conductivity = 1.5 W/mK
    • Requires mounting pressure via spring, metal clip or clamp
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  • T-Pad 1500
    • Electrically insulating and moderate thermal performance properties
    • Thermal conductivity = 1.5 W/mK
    • Requires mounting pressure via spring, metal clip or clamp
    • A1 – Adhesive layer on one side
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  • Laird Tgard K52 web

    Laird Tgard™ K52-2 – A0 – 0.076mm

    £0.00 SKU: LAIRD_TGARD_K52-2_A0_0.076MM
    • High breakdown voltage of 4,000 – 9,000 range VAC
    • Resistant to tears and cut through
    • Total thermal resistance of 0.13 – 0.30 range ºC-in2/watt at 20 psi clip force
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  • Laird tcpm910

    Laird Tpcm™ 900 Series – 910 – 0.25mm

    £0.00 SKU: LAIRD_TPCM_910_0.125MM
    • 0.03ºC-in2/watt thermal resistance
    • Naturally tacky at room temperature, no adhesive required
    • No heatsink preheating required
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  • Bergquist Sil pad900
    • Thermal impedance: 1.13ºC-in2/W @ 50 psi
    • Original Sil-Pad material
    • Excellent mechanical and physical characteristics
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  • UniGap 3000

    Universal Science UniGap 3000 – 2.5mm

    £0.00 SKU: UNISCI_UNIGAP3000_2.5MM
    • Soft and compliant gap filler with excellent thermal performance
    • Thermal conductivity = 3.0 W/ mK
    • Integral support using fabric or polymer film
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  • Universal Science T-Pad 6500
    • High dielectric strength and thermal performance
    • Thermal conductivity of 6.5W/mK
    • Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
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  • UniGap 1700US

    Universal Science UniGap 1700US – 1mm

    £0.00 SKU: UNISCI_UNIGAP1700US_1MM
    • Extremely compliant and electrically insulating
    • Thermal conductivity = 1.7W/mK
    • Naturally tacky, no need for adhesive
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  • Laird tpcm 580
    • Low total thermal resistance (0.013°C-in2/W at 50 psi)
    • inherently tacky and easy-to-use – no adhesive required
    • High reliability
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