Thermal Interface
Thermal Interface Materials
Thermal interface materials or TIM’s are used to interface between hot components or assemblies nearby heat sinks or heat spreaders. They are often electrically isolating to perform protection for the users or internally to protect other parts of the assembly from unwanted high voltages
Showing 1–15 of 615 results
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Dry compound coated onto a Kapton™ MT substrate
- Offers high dielectric strength and cut-through resistance alongside efficient heat transfer
- Delivers a highly reliable and consistent thermal interface for demanding applications
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Easy to rework
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- Dry compound coated onto an aluminium substrate
- Above phase change temperature compound becomes thixotropic and paste-like in consistency
- Delivers a highly reliable and consistent thermal interface for demanding applications
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- Superior Thermal Performance
- Improved Surface Conformity
- Long-Term Reliability
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications
- Thermal Conductivity of 5.5 W/mk
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications
- Thermal Conductivity of 5.5 W/mk
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications
- Thermal Conductivity of 5.5 W/mk
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- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
