Thermal Interface Materials
Thermal interface materials or TIM’s are used to interface between hot components or assemblies nearby heat sinks or heat spreaders. They are often electrically isolating to perform protection for the users or internally to protect other parts of the assembly from unwanted high voltages
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Showing 1–12 of 184 results
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Thermally conductive polyimide film with thermal adhesive one side
- Conformability fills micro air voids between mating surfaces reducing thermal resistance
- Provides heat exchange between component and cooling mechanism
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- Dry compound coated onto an aluminium substrate
- Above phase change temperature compound becomes thixotropic and paste-like in consistency
- Delivers a highly reliable and consistent thermal interface for demanding applications
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
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- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
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- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- A1 – Adhesive layer on one side
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- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
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- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- A1 – Adhesive layer on one side
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- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
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- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
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Compliant and electrically isolating
Thermal conductivity = 1.0 W/mK
Maintains good thermal performance over a temperature range of -50C to 160C
