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- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
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- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
- A1 – Adhesive layer on one side
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- Thermal impedance: 0.61 C-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
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- Thermal impedance: 0.23°C-in2/W (@50 psi)
- Naturally tacky on both sides
- Pad is repositionable
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- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Highly Conformable, low hardness
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
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- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
